Engineered for Density and Reliability

The heat generated by high-density computing has limited the ability of companies to capitalise on advancing technologies. Traditionally, data centres have respond to this by spreading equipment between numerous cabinets across increased floor areas to avoid power and cooling hotspots. But this generates higher management and real estate costs and precludes certain technologies that cannot be spread between cabinets.

High power density requires high capacity, localised cooling, since traditional ambient down-flow cooling designs are not capable of avoiding hot-spots or high aggregate heat loads.  The Options West London data centre is equipped with APC InfraStruXure® hot-aisle containment modules with in-row close-coupled cooling systems.   The ambient air in the clean room areas is cooled by traditional down-flow air handling units and consumed by equipment located in the cabinets.  The super-heated air exiting the densely-located equipment is contained within a sealed “hot-aisle” and is then cooled by dedicated in-aisle air-cooling units that return cooled air to the ambient space.  The containment of hot exit air, and the use of dedicated, targeted cooling for this sealed area, facilitate very high power-density cabinets and thereby enable organisations to leverage modern computing and storage technologies and to consolidate their equipment within the smallest number of cabinet footprints.  This brings design and management efficiencies as well as direct cost savings.

Cooling is via chilled water to HVAC units for ambient air control and APC in-row cooling units for hot air management.  The chilled water supply is circulated by 2N UPS- and generator-backed redundant pumping facilities and supporting infrastructure.  All cooling infrastructure is centrally managed and monitored and both ambient temperature and humidity are strongly controlled within industry standard boundaries to ensure the highest levels of environmental stability for your equipment.